Electroplating

Electroplating

Electrolytes for the Electroplating Processes

Our customers all over the world appreciate and benefit from the excellent performance of our electroplating solutions which generate high quality metal deposits even under severe working conditions. The electrolytes are suitable for both barrel and rack plating.

Cyanide copper electrolyte

  • Produces a dense fine crystalline layer

Bright copper process

  • Dyestuff-based system
  • Brilliant deposits, high levelling action and excellent throwing power
  • Suitable for both, rack and barrel plating
ArticleDescription
RUBIN F 2000dyestuff-based, two-component system + make-up solution
RUBIN F 1000dyestuff-based, one-component system + make-up solution
RUBIN T 200dyestuff-free and methanol-free system

Semi-bright nickel electrolyte

  • sulphur-free
  • high potential difference to the previous deposited bright nickel layers corrosion resistant coating systems are obtained

Bright nickel electrolytes

  • High brilliant and ductile deposits in a wide current density range. Excellent levelling power.
ArticleDescription
ORION 3000+suitable forrack plating with a well levelling efficiency
ORION 4000suitable forrack plating with a well levelling efficiency
SIRIUSsuitable forrack plating with a well levelling efficiency
POLARIS GT 10 suitable for barrel plating
POLARIS GT 24siutable for barrel plating


Satin nickel process

Type Description
MERKUR C Deposition from the dispersive system at concentrations of more than 105 g/l nickel
MERKUR D Deposition from the dispersive system at concentrations of more than 105 g/l nickel
MERKUR E Deposition from the finely dispersed system at a low metal content
MERKUR G Deposition from the dispersed system at a low metal content
MERKUR H Deposition from the dispersive system at concentrations of more than 105 g/l nickel
MERKUR I Deposition from the dispersive system at concentrations of more than 105 g/l nickel
MERKUR K Deposition from an emulsion in combination with a heating-cooling unit
MERKUR L Deposition from the dispersive system at concentrations of more than 105 g/l nickel

Trivalent and hexavalent bright chromium process

  • Excellent bright throwing and covering power
  • Suitable for all common installations

Bright Chromium Electrolytes

Type  Description
SAPHIR 14 hexavalent chromium
SAPHIR 17 hexavalent chromium
SAPHIR 1038 trivalent system, chloride-based
SAPHIR 2000 trivalent system, sulphate-based

Black Chromium Electrolytes

Type Description
SAPHIR TS excellent covering properties and short exposure times

Plastic Pre-Treatment

Colloidal system

Type Description
SURFAPLATE ET–KS Chromic/sulphuric acid etchant
SURFAPLATE Reductor Reduction of hexavalent chromium
SURFAPLATE Activator–KS Colloidal palladium activator
SURFAPLATE Accelerator–KS To accelerate the removal of the tin colloid, sour
SURFAPLATE Accelerator–ALC To accelerate the removal of the tin colloid, alkaline
SURFAPLATE EN 1000 Chemical nickel electrolyte, ammonia-free
SURFAPLATE EN 2000 Chemical nickel electrolyte, ammonia-containing

Direct metallization

Type Description
SURFAPLATE ET Chromic/sulphuric acid etchant for direct metallization
SURFAPLATE Reductor Reduction of the hexavalent chromium
SURFAPLATE Activator Highly active palladium activation for direct metallization
SURFAPLATE Selector Forms the electrically conductive matrix to which direct acid copper plating can be applied

Alkaline/non-cyanide zinc process

  • tension-free deposits
  • excellent throwing power and layer distribution

Can also be operated as Zinc-Iron-Electrolyte by using our additive TOPAS 3100 Fe

Data Sheet

Acidic zinc process

  • High brilliant and ductile deposits at high current densitie
  • Low foaming with air agitation

Also available as boric acid-free type. Data Sheet

Alkaline zinc-/nickel process

Type Description
OPAL 5000 Alkaline zinc-nickel process. Bright alloy deposits on rack and barrel plated articles. Very good layer distribution. Easy and reliable handling.
OPAL 7000 Alkaline zinc-nickel process. Specially developed for rack application; high burning resistance in the high current density area; ductile deposited zinc-nickel layers for subsequent deformation; Gloss levels from technically to high gloss adjustable.

Acid zinc/nickel process

Data Sheet

Cyanide zinc processes

  • High lustre deposits over a wide range of current density
  • Excellent bright throwing power

Acidic bright tin process

  • For both, functional and decorative tin plating
  • Finger-print and tarnishing resistant deposits

Alkaline/cyanide-free copper electrolyte

  • Dense, adherent and semi-bright layers
  • Excellent throwing power

Hard chromium process. Very high current efficiency. Available with different catalyst systems.

Article  Description
SAPHIR 25 hard chromium electrolyte, fast-depositing, fluoride-free, platinized titanium anodes required.
SAPHIR 40 hard chromium electrolyte, fast-depositing, fluoride-free.