In more than 30 countries 
Electroplating
Electrolytes for the Electroplating Processes
Our customers all over the world appreciate and benefit from the excellent performance of our electroplating solutions which generate high quality metal deposits even under severe working conditions. The electrolytes are suitable for both barrel and rack plating.
Cyanide copper electrolyte
- Produces a dense fine crystalline layer
Bright copper process
- Dyestuff-based system
- Brilliant deposits, high levelling action and excellent throwing power
- Suitable for both, rack and barrel plating
| Article | Description |
|---|---|
| RUBIN F 2000 | dyestuff-based, two-component system + make-up solution |
| RUBIN F 1000 | dyestuff-based, one-component system + make-up solution |
| RUBIN T 200 | dyestuff-free and methanol-free system |
Semi-bright nickel electrolyte
- sulphur-free
- high potential difference to the previous deposited bright nickel layers corrosion resistant coating systems are obtained
Bright nickel electrolytes
- High brilliant and ductile deposits in a wide current density range. Excellent levelling power.
| Article | Description |
|---|---|
| ORION 3000+ | suitable forrack plating with a well levelling efficiency |
| ORION 4000 | suitable forrack plating with a well levelling efficiency |
| SIRIUS | suitable forrack plating with a well levelling efficiency |
| POLARIS GT 10 | suitable for barrel plating |
| POLARIS GT 24 | siutable for barrel plating |
Satin nickel process
| Type | Description |
|---|---|
| MERKUR C | Deposition from the dispersive system at concentrations of more than 105 g/l nickel |
| MERKUR D | Deposition from the dispersive system at concentrations of more than 105 g/l nickel |
| MERKUR E | Deposition from the finely dispersed system at a low metal content |
| MERKUR G | Deposition from the dispersed system at a low metal content |
| MERKUR H | Deposition from the dispersive system at concentrations of more than 105 g/l nickel |
| MERKUR I | Deposition from the dispersive system at concentrations of more than 105 g/l nickel |
| MERKUR K | Deposition from an emulsion in combination with a heating-cooling unit |
| MERKUR L | Deposition from the dispersive system at concentrations of more than 105 g/l nickel |
Trivalent and hexavalent bright chromium process
- Excellent bright throwing and covering power
- Suitable for all common installations
Bright Chromium Electrolytes
| Type | Description |
|---|---|
| SAPHIR 14 | hexavalent chromium |
| SAPHIR 17 | hexavalent chromium |
| SAPHIR 1038 | trivalent system, chloride-based |
| SAPHIR 2000 | trivalent system, sulphate-based |
Black Chromium Electrolytes
| Type | Description |
|---|---|
| SAPHIR TS | excellent covering properties and short exposure times |
Plastic Pre-Treatment
Colloidal system
| Type | Description |
|---|---|
| SURFAPLATE ET–KS | Chromic/sulphuric acid etchant |
| SURFAPLATE Reductor | Reduction of hexavalent chromium |
| SURFAPLATE Activator–KS | Colloidal palladium activator |
| SURFAPLATE Accelerator–KS | To accelerate the removal of the tin colloid, sour |
| SURFAPLATE Accelerator–ALC | To accelerate the removal of the tin colloid, alkaline |
| SURFAPLATE EN 1000 | Chemical nickel electrolyte, ammonia-free |
| SURFAPLATE EN 2000 | Chemical nickel electrolyte, ammonia-containing |
Direct metallization
| Type | Description |
|---|---|
| SURFAPLATE ET | Chromic/sulphuric acid etchant for direct metallization |
| SURFAPLATE Reductor | Reduction of the hexavalent chromium |
| SURFAPLATE Activator | Highly active palladium activation for direct metallization |
| SURFAPLATE Selector | Forms the electrically conductive matrix to which direct acid copper plating can be applied |
Alkaline/non-cyanide zinc process
- tension-free deposits
- excellent throwing power and layer distribution
Can also be operated as Zinc-Iron-Electrolyte by using our additive TOPAS 3100 Fe
Acidic zinc process
- High brilliant and ductile deposits at high current densitie
- Low foaming with air agitation
Also available as boric acid-free type. Data Sheet
Alkaline zinc-/nickel process
| Type | Description |
|---|---|
| OPAL 5000 | Alkaline zinc-nickel process. Bright alloy deposits on rack and barrel plated articles. Very good layer distribution. Easy and reliable handling. |
| OPAL 7000 | Alkaline zinc-nickel process. Specially developed for rack application; high burning resistance in the high current density area; ductile deposited zinc-nickel layers for subsequent deformation; Gloss levels from technically to high gloss adjustable. |
Acid zinc/nickel process
Cyanide zinc processes
- High lustre deposits over a wide range of current density
- Excellent bright throwing power
Acidic bright tin process
- For both, functional and decorative tin plating
- Finger-print and tarnishing resistant deposits
Alkaline/cyanide-free copper electrolyte
- Dense, adherent and semi-bright layers
- Excellent throwing power
Hard chromium process. Very high current efficiency. Available with different catalyst systems.
| Article | Description |
|---|---|
| SAPHIR 25 | hard chromium electrolyte, fast-depositing, fluoride-free, platinized titanium anodes required. |
| SAPHIR 40 | hard chromium electrolyte, fast-depositing, fluoride-free. |